Binocular face Recognition Module DM_SV001_F1 is a stable mass production product launched by DOMI, featuring high accuracy, small size, and easy integration
This ISP(Image signal processor) module is a high performance,low power,low cost image signal processor dedicating for ToF sensor.A sophisticated ToF DSP is embedded to convert raw data to distance and IR data.Furthermore,The module is integrated with AE(auto exposure) ,HDR and other smart functions.USB2.0 output interface is available.
DM_TOF_5005A is a 3D ToF camera motherboard based on Sigmastar SOC platform, USB output, Equipped with QVGA resolution MIPI module, the case and heat sink not included, with high flexibility and cost-effectiveness.
Introducing the latest addition to our product lineup - ToF camera DMOE2008BL, Equipped with state-of-the-art technology, What sets DMOE2008BL ToF camera apart is its advanced components - an image sensor, VCSEL driver, and ToF ISP.
ToF camera DMOM2508CL is perfect for a variety of applications such as AR/VR,People counting and motion analysis, Face recognition and face motion tracking and more. Its compact size and lightweight design make it easy to integrate into terminal system.
DOMI cutting-edge ToF camera DMOM2501A, the next generation of imaging technology.With advanced time-of-flight sensing and VCSEL illumination, this Time-of-Flight camera delivers unparalleled depth accuracy and exceptional image quality in a compact form factor.
ToF camera DM_PS2601-VGA is based on ToF 3D technology,embedded with deep learning algorithm and edge computation terminal.
DMOE2008BL is a series of 3D ToF cameras, based on DOMI platform. This platform consists of image sensor,VCSEL driver, ToF ISP and all of them are developed by DOMI.
DMOM2808D tof module energy-efficient, real time depth sensing technology works both indoors and outside.
DMOM2501A is a tiny 3D camera module, based on Time-ofFlight (ToF) technology using VCSEL illumination. The high integration, low power consumption and high precision make this module ideal for depth sensing applications.
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